Multilayer Ceramic Substrate - Technology for VLSI Package / Multichip Module: Ceramic research and development in Japan - K. Otsuka - Books - Kluwer Academic Publishers Group - 9781851665792 - April 30, 1993
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Multilayer Ceramic Substrate - Technology for VLSI Package / Multichip Module: Ceramic research and development in Japan 1993 edition

K. Otsuka

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Multilayer Ceramic Substrate - Technology for VLSI Package / Multichip Module: Ceramic research and development in Japan 1993 edition

This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

242 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released April 30, 1993
ISBN13 9781851665792
Publishers Kluwer Academic Publishers Group
Pages 242
Dimensions 178 × 254 × 16 mm   ·   539 g
Language English  

See all of K. Otsuka ( e.g. Hardcover Book )