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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science Softcover Reprint of the Original 1st Ed. 2003 edition
Erdogan Madenci
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science Softcover Reprint of the Original 1st Ed. 2003 edition
Erdogan Madenci
185 pages, biography
Media | Books Paperback Book (Book with soft cover and glued back) |
Released | October 14, 2012 |
ISBN13 | 9781461349891 |
Publishers | Springer-Verlag New York Inc. |
Pages | 185 |
Dimensions | 156 × 234 × 11 mm · 299 g |
Language | English |
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