Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science - Erdogan Madenci - Books - Springer-Verlag New York Inc. - 9781461349891 - October 14, 2012
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science Softcover Reprint of the Original 1st Ed. 2003 edition

Erdogan Madenci

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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science Softcover Reprint of the Original 1st Ed. 2003 edition

185 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 14, 2012
ISBN13 9781461349891
Publishers Springer-Verlag New York Inc.
Pages 185
Dimensions 156 × 234 × 11 mm   ·   299 g
Language English  

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